5G Related Products
  • HERMETIC PACKAGE
  • Santec is a manufacture in the field of electronic and semiconductor parts. We produce "Glass to ...
  • ADY CO., LTD.
  • INTERNEPCON JAPAN
  • PILOT ECONOMICAL, COMPACT, SINGLE POINT SELECTIVE SOLDERING SYSTEM
  • The all new ultra-low cost PILOT machine has been designed as an entry level, hand load, benchtop...
  • ALPHA ELECTRONICS CORP.
  • INTERNEPCON JAPAN
  • MICRODISPENSING SYSTEM
  • This systems enable customers to achieve contact free dispensing of highly viscous media droplets...
  • ALPHA ELECTRONICS CORP.
  • INTERNEPCON JAPAN
  • STAR GATE
  • Our new laser system has changed from the power control to the temperature control. The laser ...
  • APOLLO SEIKO LTD.
  • INTERNEPCON JAPAN
  • XCCF-500
  • xCCF-500 is flexible copper-clad laminate made of fluoroplastic film. The substrate made of fluo...
  • CHUKOH CHEMICAL INDUSTRIES, LTD.
  • PRINTED WIRING BOARDS EXPO
  • XCPI-500
  • xCPI-500 is flexible copper-clad laminate made of fluoroprastic and polyimide composite. It has ...
  • CHUKOH CHEMICAL INDUSTRIES, LTD.
  • PRINTED WIRING BOARDS EXPO
  • CH2868D
  • CH2868D is a copper-clad laminate made by laminating fluoroplastic-impregnated glass cloth. It ...
  • CHUKOH CHEMICAL INDUSTRIES, LTD.
  • PRINTED WIRING BOARDS EXPO
  • MSAP(MODIFIED SEMI ADDITIVE PROCESS)
  • This production process can achieve interconnect reliability and accuracy of pattern width on one...
  • CMK CORPORATION
  • PRINTED WIRING BOARDS EXPO
  • HIGH FREQUENCY PCB
  • Low Dk/Df material used. For Milli-wave radar products etc. The circuit width high accuracy can ...
  • CMK CORPORATION
  • PRINTED WIRING BOARDS EXPO
  • RD-500VL
  • A Rework Station Designed for Large Multilayered Thick Boards Odd Shape and Circular Boards The...
  • DEN-ON INSTRUMENTS CO., LTD.
  • INTERNEPCON JAPAN
  • PH-3100A
  • It is the most suitable design for the residual heat of the board. Ideal for preheating good sold...
  • DEN-ON INSTRUMENTS CO., LTD.
  • INTERNEPCON JAPAN
  • GLASS SUBSTRATES FOR HIGH-FREQUENCY CIRCUIT BOARDS /THROUGH-HOLE PROCESSING
  • Circuit board with reduced transmission loss at higher frequencies, and Glass Through-hole.
  • EBINA DENKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • 3D WIRE FORMING TECHNOLOGY FOR IOT DEVICES
  • Further miniaturization and weight reduction of smart devices.

  • EBINA DENKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • CERAMICS SUBSTRATES WITH EXCELLENT HEAT DISSIPATION
  • Ebinax's plating technology maximizes the performance of semiconductor devices.
  • EBINA DENKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • HIGH-DENSITY AND HIGH-LAYER COUNT PCBS FOR HIGH-SPEED TRANSMISSION
  • Provide Ultra-high-speed PCBS for 5G networking systems and Millimeter-wave applications, combini...
  • FUJITSU INTERCONNECT TECHNOLOGIES LTD.
  • PRINTED WIRING BOARDS EXPO
  • MAGMA SSM HIRES
  • Magma SSM Hiresolution System
  • HIGHTEC SYSTEMS CORP.
  • ELECTROTEST JAPAN
  • MIP DECAPSULATION SYSTEM
  • Maicrowave Induced Plasma Decapsulation System
    for FA
  • HIGHTEC SYSTEMS CORP.
  • ELECTROTEST JAPAN
  • OPTICAL FIBER ASSY AND OTHERS
  • -Feedthrough fiber array cords for various modules for digital coherent (compatible with glass so...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PRECISION MACHINING, CNC LATHE & MACHINING CENTER, OTHERS
  • With 250 machine tools and 90 years of experience, we can meet various needs for automotive, tele...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • HIGH-FREQUENCY TRANSMISSION COMPONENTS | DC TO 145GHZ COAXIAL CONNECTORS
  • -Various wire/wireless RF coaxial connectors (DC-145GHz) and cable assy -Packaging for RF integr...
  • KAWASHIMA MANUFACTURING CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • 5G RELATED MOUNTING AVAILABLE
  • We can handle mounting of wireless module mounting boards and product assembly of IOT products.
  • LECIP ELECTRONICS CORP.
  • INTERNEPCON JAPAN
  • LPKF PROTOMAT S104
  • The latest high-end model of the ProtoMat series, a manufacture of PCB processing machines with t...
  • LPKF LASER & ELECTRONICS K.K.
  • INTERNEPCON JAPAN
  • LPKF PROTOLASER U4
  • LPKF ProtoLaser U4 is a microfabrication specialist. You can process metal foil on alumina substr...
  • LPKF LASER & ELECTRONICS K.K.
  • INTERNEPCON JAPAN
  • HI-POWER PRE-HEATER UNIT MPH1000
  • L version, large substrate compatible, large capacity heater
  • MEISHO CO., LTD.
  • INTERNEPCON JAPAN
  • REBCOM RBC-1
  • Re-Balling & Printing tool REBCOM RBC-1
  • MEISHO CO., LTD.
  • INTERNEPCON JAPAN
  • REWORK STATION MS9000SE
  • Next generation rework equipment MS 9000SE (LPC)
  • MEISHO CO., LTD.
  • INTERNEPCON JAPAN
  • AIP FOR 5G MM-WAVE APPLICATION / SURFACE RADIATION TYPE
  • Bandwidth : n257
    Gain : more than 10dBi (4x4)
    Expandability : 8x8/4tile, 16x16/16tile (1tile=4x4)
  • NGK SPARK PLUG CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • AIP FOR 5G MM-WAVE APPLICATION / SIDE WALL RADIATION TYPE
  • Polarization : Vertical & Horizontal Bandwidth : n257/258 (V&H=more than 6GHz) CDF : more than ...
  • NGK SPARK PLUG CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • SOLDER PASTE FOR SOLDERING WITH FORMIC ACID
  • Ultra low residue type halogen-free solder paste specialized for formic acid reduction reflow pro...
  • NIHON SUPERIOR CO., LTD.
  • INTERNEPCON JAPAN
  • COMPATIBLE LOW TEMPERATURE MOUNTING  TEMPSAVE B58
  • Completely halogen-free type Sn-Bi solder paste that can be mounted at low temperature below 200 ...
  • NIHON SUPERIOR CO., LTD.
  • INTERNEPCON JAPAN
  • ANTI CRACK TYPE LEAD-FREE SOLDER LF-C2
  • A high-strength lead-free solder paste with crack resistance. Please note the crack-resistance pr...
  • NIHON SUPERIOR CO., LTD.
  • INTERNEPCON JAPAN
  • FLYING SPOT SCANNER
  • Measuring Topography and Thickness with High accuracy (Resolution nm) and High Speed
  • PRECITEC JAPAN LTD.
  • INTERNEPCON JAPAN
  • CHROMATIC LINE SENSOR
  • Topography and Thickness measurement with High Precision (Resolution 20nm) and Speed (Max 6kHz
  • PRECITEC JAPAN LTD.
  • INTERNEPCON JAPAN
  • SPEEDWAVE(TM) 300P BONDPLY
  • New Product. Low DK and DF themoset type prepreg. It is possible to use Multi layer board. It is ...
  • ROGERS CORPORATION
  • PRINTED WIRING BOARDS EXPO
  • SERVERS, NETWORKING AND COMPUTING
  • KINWONG HAS SOLUTIONS CAPABLE OF MEETING THE NEEDS OF THIS EVER-CHANGING INDUSTRY: Metal-based P...
  • SHENZHEN KINWONG ELECTRONIC CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • RF MICROWAVE PCB
  • Many electronic applications are seeing a need for increasingly faster frequencies. As frequency ...
  • SHENZHEN KINWONG ELECTRONIC CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • USE PTFE FOR HIGH FREQUENCY BOARD
  • Use PTFE for high frequency board
  • SHENZHEN SUN&LYNN CIRCUITS CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • IOT FULL AUTOMATION GRINDER SGM-5000IT
  • For power SiC, other compound semi-conductor materials processing. 1 Remote support:An engineer ...
  • SHUWA INDUSTRY COMPANY LIMITED
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • TINY AND DEEP HOLE/GROOVE, SHARP HOLE/GROOVE
  • Micro-blasting achieves the high-aspect holes and grooves without sagging and smearing due to mel...
  • SINTOKOGIO LTD.
  • INTERNEPCON JAPAN
  • PROCESSING OF PRECISE EDGES
  • Micro-blasting makes complex shapes precise even if it is difficult for pulse laser.
  • SINTOKOGIO LTD.
  • INTERNEPCON JAPAN
  • PROCESSING OF LARGE AREA WITH MIXED DIFFERENT SHAPES ALL AT ONCE
  • Micro-blasting can process mixed different shapes all at once even if it is large area because of...
  • SINTOKOGIO LTD.
  • INTERNEPCON JAPAN
  • HIGH HEAT SPREADER AG-DIA BOARD
  • Diamond composites for advanced thermal management (Features) Ensures isotropic high thermal d...
  • TECNISCO, LTD.
  • LED & LASER DIODE TECHNOLOGY EXPO
  • 3D WIRED METALLIZED GLASS CAVITY
  • 3D shape glass structure and 3D wiring processing technology (Features) Reduction of parts. ...
  • TECNISCO, LTD.
  • LED & LASER DIODE TECHNOLOGY EXPO
  • THROUGH GLASS VIA SUBSTRATE
  • Through glass Via process (Features) Device miniaturization and multi-layer mounting. Anod...
  • TECNISCO, LTD.
  • LED & LASER DIODE TECHNOLOGY EXPO
  • PRECISION CUTTING OF CERAMIC PARTS
  • We use dicing and slicing technology for ceramic parts used in 5G-related optical communications ...
  • TOKYO DENSHI KOGYO CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PRECISION CUTTING OF GLASS PARTS
  • We process glass parts used for optical communication related to 5G with high precision by dicing...
  • TOKYO DENSHI KOGYO CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • PARTS FEEDER
  • Parts feeder that aligns and transports with low damage and no vibration
  • TORAY PRECISION CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • METAL 3D PRINTING
  • Contract modeling service using a metal 3D printer
  • TORAY PRECISION CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • HIGH-PRECIOSION PROCESSING(MANUFACTURE BY COMMISSIONING)
  • One-stop manufacturing of high-precision holes, grooves, surface finishes, etc.
  • TORAY PRECISION CO., LTD.
  • FINE PROCESS TECHNOLOGY EXPO
  • CONDUCTIVE PASTE
  • Conductive paste for 5G
    (mouldable ink,stretchable ink,silver coated copper ink)
  • TOYO INK CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • 3D CIRCUIT FORMATION ON 5G MATERIALS MPP(MULTI PLASTICS PLATING)
  • It is possible to form a circuit into a resin without selecting any material.
  • ZEFA CO., LTD.
  • ELECTRONIC COMPONENTS & MATERIALS EXPO
  • OSRDA(OUTSOURCED SEMICONDUCTOR R&D ASSEMBLY)
  • R&D service capable of flexibly all kinds of chips, sensors to all kinds of substrates using a va...
  • CONNECTEC JAPAN CO.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • MONSETERPAC
  • The world's first assembly technology with 80-170 to the most advanced IoT chips and sensors. In...
  • CONNECTEC JAPAN CO.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • LPKF LDS TECHNOLOGY
  • "LPKF LDS technology" developed by LPKF is the technology to add electric circuit on 3D mold plas...
  • LPKF LASER & ELECTRONICS K.K.
  • INTERNEPCON JAPAN
  • ELECTRONIC COMPONENT SAMPLES
  • Component samples for 5 G
  • MICRO-TEC CO., LTD.
  • INTERNEPCON JAPAN
  • BONDED WAFER
  • Composite wafer with direct bonding of two different materials. Poly crystal alumina HISERAM is p...
  • NGK INSULATORS, LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • SEAM WELDER
  • Seam welder
  • NIPPON AVIONICS CO., LTD.
  • INTERNEPCON JAPAN
  • FDI
  • Direct Imaging System for high-end circuit patterning
  • ORC MANUFACTURING CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • RO4730G3 HIGH FREQUENCY LAMINATES
  • Low DK and DF high frequency laminates for 5G and milliwave antenna.
  • ROGERS CORPORATION
  • PRINTED WIRING BOARDS EXPO
  • EXHIBITION OF FINE CIRCUITS USING THE SAP METHOD
  • We will exhibit the next-generation fine circuit using the plating seed layer by our equipment.
  • SHIBAURA MACHINE CO., LTD.
  • INTERNEPCON JAPAN
  • OVERVIEW OF HIGH-SPEED PLATING SEED LAYER FORMING EQUIPMENT
  • A plating seed layer can be formed at a high speed and short tact. It is Compatible with large pr...
  • SHIBAURA MACHINE CO., LTD.
  • INTERNEPCON JAPAN
  • EXHIBITION OF 250 X 300 MM CIRCUIT BOARDS USING EQUIPMENT FOR BOARDS
  • We will exhibit the 250 x 300 circuit made using the plating seed layer by our equipment. We will...
  • SHIBAURA MACHINE CO., LTD.
  • INTERNEPCON JAPAN
  • PHOTORESIST FOR HIGH DENSITY ELECTROPLATING PROCESSES
  • We are focused on developing photoresists for plating to address redistribution layers (RDLs) aim...
  • TOKYO OHKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • UV CURE RESIST HARDENING TOOL
  • Make resist to high thermal resistance with sophisticated UV Cure
  • TOKYO OHKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • PHOTOSENSITIVE PERMANENT MATERIAL FOR MEMS
  • TMMR Series is photoresist for MEMS application. This ultra thick film material offering covers a...
  • TOKYO OHKA KOGYO CO., LTD.
  • INTERNEPCON JAPAN
  • WAFER PROBING MACHINES
  • As the top manufacturer of wafer manufacturing and device test systems, Tokyo Seimitsu has always...
  • TOKYO SEIMITSU CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • WAFER DICING MACHINE
  • We have a wide range of products such as Blade Dicing, Laser Dicing and Plasma Dicing to solve yo...
  • TOKYO SEIMITSU CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • BACK GRINDER
  • We will introduce the Back Grinder which has achieved high quality and high accuracy. It is appli...
  • TOKYO SEIMITSU CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • HIGH FUNCTIONAL BLACK AND WHITE INKS FOR 5G SOCIETY
  • Light control functions such as "light shielding / Anti reflection" are important for electronic ...
  • TOYO INK CO., LTD.
  • PRINTED WIRING BOARDS EXPO
  • NCT-6300 TAPING HANDLER FOR WAFER
  • To pick up a chip from a wafer, test for electrical characteristics, reject defective chips, and ...
  • YAC GARTER CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • NST-610 FULL AUTO HIGH SPEED CHIP SORTER
  • NST-610 series is a sorting machine with a vacuum contact arm that picks up LED chips on a wafer ...
  • YAC GARTER CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
  • LX7210A LD TESTER
  • A great performance of LED measurement with a high speed testing time in LED production line. E...
  • YAC GARTER CO., LTD.
  • IC & SENSOR PACKAGING TECHNOLOGY EXPO
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